A research programme has been developed in order to investigate the corrosion behaviour of metallic materials commonly used in solar heating systems. This paper presents the results of an experimental study on copper corrosion resistance in ethylene and propylene glycol/water solutions (1:1 by volume) constituting the most common bases of heat transfer fluids. Long-time gravimetric tests were carried out on electrolytic copper at 80 °C, even in glycol/ water solutions previously degraded at their boiling temperatures or polluted with 200 ppm chlorides. Chemical composition, semiconducting properties and morphological characteristics of all surface products were investigated by X-ray diffraction analysis, pulse photopotential techniques and SEM observations, respectively. Heat transfer effects on copper corrosion and copper/6351 aluminium alloy couple efficiency were evaluated by electrochemical tests. The following results were obtained: - Ethylene and propylene glycol/water solutions are low corrosive media. Nevertheless, chloride pollution and/or high temperature degradation of glycols markedly increase their aggressiveness. Under all the experimental conditions, copper corrosion rate are higher in ethylene than propylene glycol solutions. - In chloride-free solutions, heat transfer stimulates the cathodic reaction of the copper corrosion process. - Galvanic contact between copper and aluminium alloy always causes pitting corrosion on aluminium electrodes. The severity of the pitting attack is enhanced by the presence of heat transfer conditions on copper and/or chloride ions in the solutions, particularly in ethylene glycol.
Corrosion in solar heating systems. I: Copper behaviour in water/glycol solutions
MONTICELLI, Cecilia;BRUNORO, Giancarlo;TRABANELLI, Giordano;FRIGNANI, Alessandro
1986
Abstract
A research programme has been developed in order to investigate the corrosion behaviour of metallic materials commonly used in solar heating systems. This paper presents the results of an experimental study on copper corrosion resistance in ethylene and propylene glycol/water solutions (1:1 by volume) constituting the most common bases of heat transfer fluids. Long-time gravimetric tests were carried out on electrolytic copper at 80 °C, even in glycol/ water solutions previously degraded at their boiling temperatures or polluted with 200 ppm chlorides. Chemical composition, semiconducting properties and morphological characteristics of all surface products were investigated by X-ray diffraction analysis, pulse photopotential techniques and SEM observations, respectively. Heat transfer effects on copper corrosion and copper/6351 aluminium alloy couple efficiency were evaluated by electrochemical tests. The following results were obtained: - Ethylene and propylene glycol/water solutions are low corrosive media. Nevertheless, chloride pollution and/or high temperature degradation of glycols markedly increase their aggressiveness. Under all the experimental conditions, copper corrosion rate are higher in ethylene than propylene glycol solutions. - In chloride-free solutions, heat transfer stimulates the cathodic reaction of the copper corrosion process. - Galvanic contact between copper and aluminium alloy always causes pitting corrosion on aluminium electrodes. The severity of the pitting attack is enhanced by the presence of heat transfer conditions on copper and/or chloride ions in the solutions, particularly in ethylene glycol.I documenti in SFERA sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
