The effect of thermal cycling on the microstructure and mechanical properties of the AA6061-20% SiCw composite was studied under constant stresses. The microstructural evolution of the composite was analyzed using light microscopy, scanning electron microscopy image analysis, and transmission electron microscopy. The tensile behavior was correlated with the microstructural characteristics of the material. It is shown that thermal cycling with and without external strain results in significant tensile elongations.
Thermal cycling and strain behavior of AA6061-20% SiCw composite
GARAGNANI, Gian Luca;
1992
Abstract
The effect of thermal cycling on the microstructure and mechanical properties of the AA6061-20% SiCw composite was studied under constant stresses. The microstructural evolution of the composite was analyzed using light microscopy, scanning electron microscopy image analysis, and transmission electron microscopy. The tensile behavior was correlated with the microstructural characteristics of the material. It is shown that thermal cycling with and without external strain results in significant tensile elongations.File in questo prodotto:
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