The mechanical e!ects of two etching treatments commonly applied on silicon wafers for the PV industry, are considered. The failure characteristics of this material under concentrated load are shown . In both cases, the maximum elongation and sustainable load of the etched wafers were measured to be higher than those of the original sample. The employed experimental procedure and results are presented here and a statistical data analysis substantiates the results observed. An attempt of explanation for this e!ect is o!ered based on the removal of a shallow highly defective layer induced by the etching of the material. .
Mechanical effects of chemical etchings on monocrystalline silicon for photovoltaic use
STEFANCICH, Marco;BUTTURI, Maria Angela;VINCENZI, Donato;MARTINELLI, Giuliano
2001
Abstract
The mechanical e!ects of two etching treatments commonly applied on silicon wafers for the PV industry, are considered. The failure characteristics of this material under concentrated load are shown . In both cases, the maximum elongation and sustainable load of the etched wafers were measured to be higher than those of the original sample. The employed experimental procedure and results are presented here and a statistical data analysis substantiates the results observed. An attempt of explanation for this e!ect is o!ered based on the removal of a shallow highly defective layer induced by the etching of the material. .File in questo prodotto:
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